Thermal Warpage Metrology
Coplanarity measurement in substrates, components and PCBs.
Akrometrix is a global leader in metrology solutions, offering solutions for measuring warpage in thermal profile and/or at room temperature, as well as testing services for analysis of warpage, deformation and coefficient of thermal expansion (CTE).
AXP 2.0
Substrate Warpage Measurement
The TherMoiré AXP 2.0 is a modular metrology solution that utilizes the Shadow Moiré measurement technique, combined with automated phase scaling, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile. The combination of Shadow Moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyzing mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré AXP 2.0, engineers can gain a better understanding of the interactions between materials, packaging, substrates, and complete assemblies.
